David Savastano, Editor03.18.15
Flexible integrated circuits (ICs) are an essential ingredient in order to make printed flexible electronics, and there are a wide variety of technologies being developed to meet these needs. The approach that the manufacturer chooses in order to achieve these circuits differentiates the technology.
American Semiconductor, Inc., an industry leader in flexible integrated circuits and flexible hybrid systems development, has developed innovative Silicon-on-Polymer (SoP) manufacturing circuits.
“Flexible Hybrid electronics is our key market and we support market segments such as bio-patch, wearable electronics, and structurally integrated electronics,” said Douglas Hackler, American Semiconductor’s president. “Our key technology is Silicon-on-Polymer and the aspects of manufacturing related to hybrid utilization such as die attach, die connect, flexible system layout and design, and overall hybrid system integration.
“We have actually worked and are working on three projects of significant interest,” Hackler added. “These include the development of a bio-patch sweat sensor, structural integration of flexible hybrid systems for transportation and development kits to support new product developers.”
Headquartered in Boise, ID, American Semiconductor is a complete services provider for flexible ICs, from concept to fabrication, offering a full portfolio of engineering and manufacturing services. Hackler noted that American Semiconductor was founded in 2001 as an advanced R&D company focused on development of new CMOS technology, before it moved into flexible ICs.
“The company became involved in flexible electronics in 2009 when it first demonstrated flexible single crystalline FleX™ Silicon-on-Polymer manufacturing concepts at the FlexTech conference,” Hackler added. “We saw the potential for hybrid systems, and the company was realigned to focus on flexible technology development.”
Typically, hybrid systems are a combination of die attach and electrical interconnect for printed and conventional materials. Working in conjunction with Soligie, American Semiconductor has successfully demonstrated a solution using anisotropic adhesive to mechanically adhere die to substrate as well as make electrical connections to printed substrate traces.
Most recently, American Semiconductor released its FleXform-ADC development kit that includes fully functional flexible hybrid systems, support hardware and software. The FleXform-ADC is a flexible hybrid system in itself, and allows users to add their sensors and other printed devices for research, development, prototyping, and demonstration.
“The company is currently in the process of constructing a new manufacturing facility in Boise to support initial production of FleXform development kits and new ICs based on SoP technology,” Hackler said.
American Semiconductor’s business includes providing silicon content and preforming contract manufacturing. Standard FleX-ICs are supported with services that include design, foundry selection, foundry management and test. Contract manufacturing includes engineering support and integration for flexible hybrid systems, printed electronics design and fabrication, antenna design and fabrication, FleX SoP, prototype development and production. Hackler noted that American Semiconductor has the capability to design, fabricate and assemble fully flexible FleX-ICs and then integrate them into flexible hybrid systems.
“American Semiconductor has demonstrated the highest complexity, highest performance fully flexible integrated circuits ever produced,” Hackler added. “The most recent demonstration is the new fully flexible FleX-ADC (Analog-to-Digital Converter).”
Hackler noted that he is seeing more interest in flexible ICs, but the industry is waiting for the killer app to emerge.
“We are seeing a lot of growth in interest, however, a mainstream flexible electronic product has not yet emerged,” Hackler concluded. “While a lot of technology has been developed, the ability to integrate the various interconnect, sensor and device components still seems to be a challenge.”
“Our outlook is to grow with the industry,” Hackler added. “Our focus is to enable new products with the availability of a commercial development kit and then to grow as our customers grow.”
American Semiconductor, Inc., an industry leader in flexible integrated circuits and flexible hybrid systems development, has developed innovative Silicon-on-Polymer (SoP) manufacturing circuits.
“Flexible Hybrid electronics is our key market and we support market segments such as bio-patch, wearable electronics, and structurally integrated electronics,” said Douglas Hackler, American Semiconductor’s president. “Our key technology is Silicon-on-Polymer and the aspects of manufacturing related to hybrid utilization such as die attach, die connect, flexible system layout and design, and overall hybrid system integration.
“We have actually worked and are working on three projects of significant interest,” Hackler added. “These include the development of a bio-patch sweat sensor, structural integration of flexible hybrid systems for transportation and development kits to support new product developers.”
Headquartered in Boise, ID, American Semiconductor is a complete services provider for flexible ICs, from concept to fabrication, offering a full portfolio of engineering and manufacturing services. Hackler noted that American Semiconductor was founded in 2001 as an advanced R&D company focused on development of new CMOS technology, before it moved into flexible ICs.
“The company became involved in flexible electronics in 2009 when it first demonstrated flexible single crystalline FleX™ Silicon-on-Polymer manufacturing concepts at the FlexTech conference,” Hackler added. “We saw the potential for hybrid systems, and the company was realigned to focus on flexible technology development.”
Typically, hybrid systems are a combination of die attach and electrical interconnect for printed and conventional materials. Working in conjunction with Soligie, American Semiconductor has successfully demonstrated a solution using anisotropic adhesive to mechanically adhere die to substrate as well as make electrical connections to printed substrate traces.
Most recently, American Semiconductor released its FleXform-ADC development kit that includes fully functional flexible hybrid systems, support hardware and software. The FleXform-ADC is a flexible hybrid system in itself, and allows users to add their sensors and other printed devices for research, development, prototyping, and demonstration.
“The company is currently in the process of constructing a new manufacturing facility in Boise to support initial production of FleXform development kits and new ICs based on SoP technology,” Hackler said.
American Semiconductor’s business includes providing silicon content and preforming contract manufacturing. Standard FleX-ICs are supported with services that include design, foundry selection, foundry management and test. Contract manufacturing includes engineering support and integration for flexible hybrid systems, printed electronics design and fabrication, antenna design and fabrication, FleX SoP, prototype development and production. Hackler noted that American Semiconductor has the capability to design, fabricate and assemble fully flexible FleX-ICs and then integrate them into flexible hybrid systems.
“American Semiconductor has demonstrated the highest complexity, highest performance fully flexible integrated circuits ever produced,” Hackler added. “The most recent demonstration is the new fully flexible FleX-ADC (Analog-to-Digital Converter).”
Hackler noted that he is seeing more interest in flexible ICs, but the industry is waiting for the killer app to emerge.
“We are seeing a lot of growth in interest, however, a mainstream flexible electronic product has not yet emerged,” Hackler concluded. “While a lot of technology has been developed, the ability to integrate the various interconnect, sensor and device components still seems to be a challenge.”
“Our outlook is to grow with the industry,” Hackler added. “Our focus is to enable new products with the availability of a commercial development kit and then to grow as our customers grow.”