Dave Savastano11.20.14
By David Savastano
Following up on a successful first day, complete with rccord attendance, Printed Electronics USA 2014, organized by IDTechEx, heads into its closing session on Nov. 20 with a total of nine concurrent sessions (three for printed electronis (PE), and one each for Wearables, Graphene, Internet of Things, 3D Printing, Supercapacitors and Energy Harvesting and Storage) for attendees to choose.
Tracks 1, 2 and 3 will cover various aspects of printed electronics. Track 1 starts with Printed Electronics Manufacturing Hybrid Electronics, with Acreo and VTT presenting talks. R2R Manufacturing Breakthroughs will be the focus of talks by Asahi Kasei Corporation and Sunchon National University. Asada Mesh Co., Ltd. will cover Screen Printing, while Inkjet Printing will be discussed by speakers from Seradrop, SIJTechnology Inc and PixDro.
After lunch, speakers will cover Gravure Printing (GT+W), Post Print Processing (NovaCentrix, Heraeus Noblelight Ltd. and XENON Corporation). New Processes will be the last session of Track 1, with Appvion presenting on the subject.
Track 2 starts with Transparent Conductive Films , featuring talks by C3Nano, Canatu and Heraeus GmbH. This will be followed by Structural Electronics, led by American Semiconductor, Inc. Conductive Inks will feature three talks, given by GSI Technologies, Agfa Materials and Intrinsiq Materials.
Barrier Films and Encapsulation will be the topic of six talks during Track 2, with presenters from 3M Display Materials,Vitriflex, SCHOTT AG, Kateeva, Lotus Applied Technology and Vinci Technologies.
There will be three closing keynote talks at the end of Track 2: C.H. Chien of Industrial Technology Research Institute (ITRI) will discuss “Commercialization of Emerging Technologies for Printed Electronics.” Felix Ho of YFY will cover “Revolution of Display and Communication - The ePaper & RFID Technology in YFY Corporation.” Anthony Shimkin, Qualcomm, will close the conference with “Are we there yet? What will it take for PE to achieve critical mass?”
Track 3’s first topic is Actuators and Speakers, with three talks by Parker Hannifin, Wacker Chemical and Piezotech. The next topic, Transistor Fabrication, features a talk by Smartkem Ltd.
Next up is an End User Forum, with panelists from United Technologies Research Center, DECATHLON, Jaguar Land Rover Research and Boeing. That will be followed by Imec, discussing the topic of Services.
Bio-electronics will be the topic for the Microelectronics Center of Provence and the Nano-Bio Manufacturing Consortium. Progress with Carbon Nanotubes will be covered by Raymor Industries, the National Research Council Canada, OCSiAl and SouthWest NanoTechnologies. Along those lines, New Material Developments will be the focus of a talk by Quantum Materials.
The Wearables track includes five speakers discussing eTextiles (DECATHLON, Sensoria, Clothing+, Sensing Tex and Teiimo). Ten companies will cover Flexible and Stretchable Electronics: Ohmatex ApS, CETEMMSA, Holst Centre, University of Tokyo, BeBop Sensors, Eeonyx, Seoul National University, Suzhou Institute of Nano-tech and Nano-bionics, Texas Instruments, HZO Inc. and SOA Software.
Graphene Applications’ track leads off Graphene LIVE! with talks by Directa Plus, Graphene Technologies, Graphenea and Graphene Frontiers. Graphene Technology Developments includes presentations by Momentive, Thomas Swan, Abalonyx and PPG Industries. Graphene closes the session with five talks, by Haydale Ltd., Nanoxplore, CVD Equipment Corporation, Aixtron and Thermo Fisher Scientific.
The Supercapacitors Track begins with the subject of Supercapacitors in Vehicle Applications, which features talks by United Chemi-Con, Imperial College, Visedo Oy and Torino e-district.
Supercapacitors New Material Developments will be analyzed by University of California, Berkeley, University of California, Santa Barbara and Elbit Systems. New Forms: Thin, Flexible Energy Storage will be discussed by University of Missouri, Paper Battery Company, Imprint Energy, Enfucell and Ulvac Technologies. Ulvac Technologies Dr Takehito Jinbo Chief Manager Japan “Manufacturing Solutions for All-Solid-State Thin-Film Lithium Secondary Batteries” Dream Weaver will close the Supercapicitors session with the topic of Separators.
Internet of Things Applications starts with talks by Belkin and Digimarc. IoT Sensor Systems features General Electric and Linear Technology/Dust Networks. IoT Commercialization Panel Discussion follows with panelists from Freescale Semiconductor, Inc., B&B Electronics and AT&T Internet of Things Solutions.
Connecting the Edge - RAIN Session - RAIN and why RFID is the key for IoT includes four presentations: RAIN RFID, Feig Electronics, SMARTRAC Technology Pte. Ltd. and SecureRF Corporation. IPSO Alliance Panel Discussion IPSO Alliance Panel Discussion IPSO Alliance Panel Discussion IPSO Alliance Panel Discussion and IOT Options, with NFC Forum, ZigBee Alliance and CSR, ends the IoT track.
Energy Harvesting & Storage begins with two talks on Energy Harvesting and Aerospace, presented by NASA - Jet Propulsion Laboratory and the National Institute of Aerospace. Energy Harvesting Systems, the next topic, will be covered by EnOcean Inc. and Spansion. Pizoelectric Energy Harvesting includes talks by MicroGen Systems and IDTechEx; Power Optimization has talks by Analog Devices and Linear Technology. Closing this track, Intelligent Buildings and IoT includes eight talks: Intel, Continental Automated Buildings Association (CABA), Greenwave, Undercurrent, Coversant, WiTricity Corporation, NXP Semiconductors NXP Semiconductors and Slater Technology Fund.
3D Printing LIVE! opens Day 2 with The Maker Movement: Advances in Desktop 3D Printing, with talks scheduled by MakerBot, Airwolf 3D, Printrbot, MadeSolid and OmniDynamics. New Material Advances for 3D Printing will be discussed by Arevo Labs, Metalysis, Graphene 3D Lab, CRP USA and Cabot Corporation. The third topic, 3D Printing and Structural Electronics, will feature presenters from Printed Performance Innovations, Lawrence Livermore National Laboratory and Newton Cyberfacturing, Inc. Newton Cyberfacturing, Inc. Mr C. Mike Newton CEO/Cofounder United State. Design and Manufacturing will be the final session, with a talk by Fathom.
Following up on a successful first day, complete with rccord attendance, Printed Electronics USA 2014, organized by IDTechEx, heads into its closing session on Nov. 20 with a total of nine concurrent sessions (three for printed electronis (PE), and one each for Wearables, Graphene, Internet of Things, 3D Printing, Supercapacitors and Energy Harvesting and Storage) for attendees to choose.
Tracks 1, 2 and 3 will cover various aspects of printed electronics. Track 1 starts with Printed Electronics Manufacturing Hybrid Electronics, with Acreo and VTT presenting talks. R2R Manufacturing Breakthroughs will be the focus of talks by Asahi Kasei Corporation and Sunchon National University. Asada Mesh Co., Ltd. will cover Screen Printing, while Inkjet Printing will be discussed by speakers from Seradrop, SIJTechnology Inc and PixDro.
After lunch, speakers will cover Gravure Printing (GT+W), Post Print Processing (NovaCentrix, Heraeus Noblelight Ltd. and XENON Corporation). New Processes will be the last session of Track 1, with Appvion presenting on the subject.
Track 2 starts with Transparent Conductive Films , featuring talks by C3Nano, Canatu and Heraeus GmbH. This will be followed by Structural Electronics, led by American Semiconductor, Inc. Conductive Inks will feature three talks, given by GSI Technologies, Agfa Materials and Intrinsiq Materials.
Barrier Films and Encapsulation will be the topic of six talks during Track 2, with presenters from 3M Display Materials,Vitriflex, SCHOTT AG, Kateeva, Lotus Applied Technology and Vinci Technologies.
There will be three closing keynote talks at the end of Track 2: C.H. Chien of Industrial Technology Research Institute (ITRI) will discuss “Commercialization of Emerging Technologies for Printed Electronics.” Felix Ho of YFY will cover “Revolution of Display and Communication - The ePaper & RFID Technology in YFY Corporation.” Anthony Shimkin, Qualcomm, will close the conference with “Are we there yet? What will it take for PE to achieve critical mass?”
Track 3’s first topic is Actuators and Speakers, with three talks by Parker Hannifin, Wacker Chemical and Piezotech. The next topic, Transistor Fabrication, features a talk by Smartkem Ltd.
Next up is an End User Forum, with panelists from United Technologies Research Center, DECATHLON, Jaguar Land Rover Research and Boeing. That will be followed by Imec, discussing the topic of Services.
Bio-electronics will be the topic for the Microelectronics Center of Provence and the Nano-Bio Manufacturing Consortium. Progress with Carbon Nanotubes will be covered by Raymor Industries, the National Research Council Canada, OCSiAl and SouthWest NanoTechnologies. Along those lines, New Material Developments will be the focus of a talk by Quantum Materials.
The Wearables track includes five speakers discussing eTextiles (DECATHLON, Sensoria, Clothing+, Sensing Tex and Teiimo). Ten companies will cover Flexible and Stretchable Electronics: Ohmatex ApS, CETEMMSA, Holst Centre, University of Tokyo, BeBop Sensors, Eeonyx, Seoul National University, Suzhou Institute of Nano-tech and Nano-bionics, Texas Instruments, HZO Inc. and SOA Software.
Graphene Applications’ track leads off Graphene LIVE! with talks by Directa Plus, Graphene Technologies, Graphenea and Graphene Frontiers. Graphene Technology Developments includes presentations by Momentive, Thomas Swan, Abalonyx and PPG Industries. Graphene closes the session with five talks, by Haydale Ltd., Nanoxplore, CVD Equipment Corporation, Aixtron and Thermo Fisher Scientific.
The Supercapacitors Track begins with the subject of Supercapacitors in Vehicle Applications, which features talks by United Chemi-Con, Imperial College, Visedo Oy and Torino e-district.
Supercapacitors New Material Developments will be analyzed by University of California, Berkeley, University of California, Santa Barbara and Elbit Systems. New Forms: Thin, Flexible Energy Storage will be discussed by University of Missouri, Paper Battery Company, Imprint Energy, Enfucell and Ulvac Technologies. Ulvac Technologies Dr Takehito Jinbo Chief Manager Japan “Manufacturing Solutions for All-Solid-State Thin-Film Lithium Secondary Batteries” Dream Weaver will close the Supercapicitors session with the topic of Separators.
Internet of Things Applications starts with talks by Belkin and Digimarc. IoT Sensor Systems features General Electric and Linear Technology/Dust Networks. IoT Commercialization Panel Discussion follows with panelists from Freescale Semiconductor, Inc., B&B Electronics and AT&T Internet of Things Solutions.
Connecting the Edge - RAIN Session - RAIN and why RFID is the key for IoT includes four presentations: RAIN RFID, Feig Electronics, SMARTRAC Technology Pte. Ltd. and SecureRF Corporation. IPSO Alliance Panel Discussion IPSO Alliance Panel Discussion IPSO Alliance Panel Discussion IPSO Alliance Panel Discussion and IOT Options, with NFC Forum, ZigBee Alliance and CSR, ends the IoT track.
Energy Harvesting & Storage begins with two talks on Energy Harvesting and Aerospace, presented by NASA - Jet Propulsion Laboratory and the National Institute of Aerospace. Energy Harvesting Systems, the next topic, will be covered by EnOcean Inc. and Spansion. Pizoelectric Energy Harvesting includes talks by MicroGen Systems and IDTechEx; Power Optimization has talks by Analog Devices and Linear Technology. Closing this track, Intelligent Buildings and IoT includes eight talks: Intel, Continental Automated Buildings Association (CABA), Greenwave, Undercurrent, Coversant, WiTricity Corporation, NXP Semiconductors NXP Semiconductors and Slater Technology Fund.
3D Printing LIVE! opens Day 2 with The Maker Movement: Advances in Desktop 3D Printing, with talks scheduled by MakerBot, Airwolf 3D, Printrbot, MadeSolid and OmniDynamics. New Material Advances for 3D Printing will be discussed by Arevo Labs, Metalysis, Graphene 3D Lab, CRP USA and Cabot Corporation. The third topic, 3D Printing and Structural Electronics, will feature presenters from Printed Performance Innovations, Lawrence Livermore National Laboratory and Newton Cyberfacturing, Inc. Newton Cyberfacturing, Inc. Mr C. Mike Newton CEO/Cofounder United State. Design and Manufacturing will be the final session, with a talk by Fathom.