David Savastano, Editor09.24.14
There are certain technology-rich companies to keep an eye on when promising new technologies surface. These companies typically have placed an emphasis on R&D and have the financial power to make headway into markets.
Hewlett-Packard (HP) is one of the most innovative companies in the world, developing state-of-the-art printers, laptops and much more. Its ink formulation labs are extensive (the company does not manufacture its inks, but develops them). It should not come as a surprise that HP is actively working in the printed electronics space.
Jim Stasiak, distinguished technologist, Printing Technology Development organization at HP, noted that the Printer Technology Development organization in Corvallis, OR has been exploring various printed materials, flexible electronics and printed electronics opportunities for more than a decade.
“We have explored technologies that benefit from large area flexible substrates using roll-to-roll manufacturing,” said Stasiak, who is also researching “printable biology” and bio-fabrication using digital printing methods. “Some of these technologies include flexible displays, sensors, flexible electrics and circuits.”
HP’s Printing Technology Development organization has the advantage of working closely with other HP divisions, as well as outside organizations such as the Defense Advanced Research Projects Agency (DARPA).
“Over the years, we have had collaborations with other HP divisions (e.g. HP Labs) and also external organizations that have included universities, other companies and government funding agencies such as DARPA,” Stasiak noted.
As a result, HP has made some interesting advancements in the field of flexible electronics.
“We have developed a family of electronic materials that are compatible with non-silicon substrates,” Stasiak said. “Specifically, in collaboration with one of our university partners, we developed and demonstrated new metal oxide semiconductors with electronic properties that are superior to amorphous silicon. These materials can be deposited and processed at temperatures less than ~300°C, making it possible to fabricate high performance electronic devices and circuits on plastic substrates.”
Stasiak sees much potential for printed electronics, particularly with flexible displays and solar cells.
“Printed electronics as a technology is still looking for its ‘killer app,” he said. “I believe that the technology and related manufacturing methods will have their initial success as a means to produce lightweight flexible displays (printed color filters, OLEDs, and flexible front- and back-planes).
“The other high impact area where printed materials and R2R manufacturing will succeed is in photovoltaics and solar panels,” Stasiak added. “As printable photovoltaic materials (e.g. CIGS) continue to improve their conversion efficiencies, it will become economically viable to produce large area, lightweight and conformal panels that will compete with the incumbent a-Si technologies. It is also likely that applications such as auto-darkening windows and solid state lighting will also emerge in the near future.”
Hewlett-Packard (HP) is one of the most innovative companies in the world, developing state-of-the-art printers, laptops and much more. Its ink formulation labs are extensive (the company does not manufacture its inks, but develops them). It should not come as a surprise that HP is actively working in the printed electronics space.
Jim Stasiak, distinguished technologist, Printing Technology Development organization at HP, noted that the Printer Technology Development organization in Corvallis, OR has been exploring various printed materials, flexible electronics and printed electronics opportunities for more than a decade.
“We have explored technologies that benefit from large area flexible substrates using roll-to-roll manufacturing,” said Stasiak, who is also researching “printable biology” and bio-fabrication using digital printing methods. “Some of these technologies include flexible displays, sensors, flexible electrics and circuits.”
HP’s Printing Technology Development organization has the advantage of working closely with other HP divisions, as well as outside organizations such as the Defense Advanced Research Projects Agency (DARPA).
“Over the years, we have had collaborations with other HP divisions (e.g. HP Labs) and also external organizations that have included universities, other companies and government funding agencies such as DARPA,” Stasiak noted.
As a result, HP has made some interesting advancements in the field of flexible electronics.
“We have developed a family of electronic materials that are compatible with non-silicon substrates,” Stasiak said. “Specifically, in collaboration with one of our university partners, we developed and demonstrated new metal oxide semiconductors with electronic properties that are superior to amorphous silicon. These materials can be deposited and processed at temperatures less than ~300°C, making it possible to fabricate high performance electronic devices and circuits on plastic substrates.”
Stasiak sees much potential for printed electronics, particularly with flexible displays and solar cells.
“Printed electronics as a technology is still looking for its ‘killer app,” he said. “I believe that the technology and related manufacturing methods will have their initial success as a means to produce lightweight flexible displays (printed color filters, OLEDs, and flexible front- and back-planes).
“The other high impact area where printed materials and R2R manufacturing will succeed is in photovoltaics and solar panels,” Stasiak added. “As printable photovoltaic materials (e.g. CIGS) continue to improve their conversion efficiencies, it will become economically viable to produce large area, lightweight and conformal panels that will compete with the incumbent a-Si technologies. It is also likely that applications such as auto-darkening windows and solid state lighting will also emerge in the near future.”