EMS inks and adhesives have been designed for compatibility in chemistry and mechanical stress.
The unique stack-up design channels paste placement for fillet strength and higher yield with smaller devices.
Features |
Advantages |
Benefits |
Chemically compatible |
Fully additive, fully compatible |
No mix-n-match guess work |
Mechanical stress compatible |
Withstands severe SMT mandrel and crease cycles |
Durable in assembly and field service |
Moisture resistant |
No silver migration in 85%RH/85°C 5VDC aging >500 hours |
Circuitry withstands humid climates |
Fine needle or jet dispensing |
Precise placement of conductive adhesive, staking compound and encapsulant. |
Fast and precise SMT attachment of smaller and less expensive SMD |