07.07.17
REC Group has awarded Meyer Burger a contract for the delivery and installation of the latest generation DW 288 Series 3 diamond wire cutting platform for multi-crystalline silicon block slicing. Total contract volume is approximately CHF 12 million ($12.5 million) and delivery of the equipment will start in Q3 2017.
REC Group is an integrated European brand for solar panels that will shift its entire multi-silicon wafer slicing to diamond wire cutting technology. REC Group has selected Meyer Burger’s latest generation diamond wire cutting equipment for its vertically integrated manufacturing in Singapore. Delivery of the equipment will start in the third quarter 2017.
“This important order confirms our excellent long-term relationship with REC and once more demonstrates that Meyer Burger’s DW 288 Series 3 diamond wire cutting technology remains the industry-leading solution for the cost-effective production of solar wafers,” said Hans Brändle, CEO of Meyer Burger Technology Ltd.
REC Group is an integrated European brand for solar panels that will shift its entire multi-silicon wafer slicing to diamond wire cutting technology. REC Group has selected Meyer Burger’s latest generation diamond wire cutting equipment for its vertically integrated manufacturing in Singapore. Delivery of the equipment will start in the third quarter 2017.
“This important order confirms our excellent long-term relationship with REC and once more demonstrates that Meyer Burger’s DW 288 Series 3 diamond wire cutting technology remains the industry-leading solution for the cost-effective production of solar wafers,” said Hans Brändle, CEO of Meyer Burger Technology Ltd.