05.04.17
Thin, organic and large area electronics or hybrid printed electronics is a continuously growing technology with estimation of €37 billion market reach in 2018. In order to secure European dominant position, all major RTD’S on hybrid hin, organic and large area electronics are developing an open access pilot line that will impel the commercial adoption of this promising technology.
The project, titled InSCOPE, has received funding from the European Union’s Horizon 2020 research and innovation programme, and aims to create an open access pilot line service for hybrid and printed systems. The pilot line is modular ensuring a comprehensive toolbox of printing, assembly, production integration and process validation distributed over the InSCOPE partners. The technology is well suited for applications that require flexibility combined with smart functionalities, especially in the health, smart packaging and smart building, and automotive sector. Lower manufacturing cost and fast access to prototypes are the main drivers of hybrid process integration for potential users.
InSCOPE, the Pilot line service is serviced by top European RTD’s with leading technological positions and state of the art equipment in the domain of H-TOLAE.
The InSCOPE consortium brings together a multi-disciplinary group composed of 11 partners and eight countries within the European Union, including Holst/TNO from Netherlands, Centre for Process Innovation (CPI) Limited from United Kingdom, Commissariat à l’énergie Atomique et aux énergies Alternatives (CEA) from France, Teknologian tutkimuskeskus VTT Oy from Finland, Interuniversitair Microelectronicacentrum IMEC VZW from Belgium, Philips Lighting B.V. from Netherlands; Robert Bosch GMBH from Germany, Walter Pak SL from Spain, Glaxosmithkline Research and Development LTD from United Kingdom, Kone Oyi from Finland and Amires from Czech Republic.
The project, titled InSCOPE, has received funding from the European Union’s Horizon 2020 research and innovation programme, and aims to create an open access pilot line service for hybrid and printed systems. The pilot line is modular ensuring a comprehensive toolbox of printing, assembly, production integration and process validation distributed over the InSCOPE partners. The technology is well suited for applications that require flexibility combined with smart functionalities, especially in the health, smart packaging and smart building, and automotive sector. Lower manufacturing cost and fast access to prototypes are the main drivers of hybrid process integration for potential users.
InSCOPE, the Pilot line service is serviced by top European RTD’s with leading technological positions and state of the art equipment in the domain of H-TOLAE.
The InSCOPE consortium brings together a multi-disciplinary group composed of 11 partners and eight countries within the European Union, including Holst/TNO from Netherlands, Centre for Process Innovation (CPI) Limited from United Kingdom, Commissariat à l’énergie Atomique et aux énergies Alternatives (CEA) from France, Teknologian tutkimuskeskus VTT Oy from Finland, Interuniversitair Microelectronicacentrum IMEC VZW from Belgium, Philips Lighting B.V. from Netherlands; Robert Bosch GMBH from Germany, Walter Pak SL from Spain, Glaxosmithkline Research and Development LTD from United Kingdom, Kone Oyi from Finland and Amires from Czech Republic.