01.30.17
Optomec, a leading global supplier of production grade additive manufacturing systems for 3D printed metals and 3D printed electronics, will feature its Aerosol Jet 3D technology at the Innovations in Large-Area Electronics (InnoLAE) Conference on Jan. 31-Feb. 1. The conference will take place at the Genome Campus Conference Centre in Cambridge, UK.
In addition to the exhibition, Dr. Mike Renn, CTO for Optomec, will give a presentation in the Flexible Hybrid Systems track, titled “Aerosol Jet Printing of Flexible and Stretchable Interconnects” at 13:45 on Feb. 1.
Dr. Renn’s presentation will discuss how flexible hybrid circuits typically require interconnecting rigid bare silicon or packaged die to a flexible circuit board. Flexing these assemblies can cause extreme stress on the electrical connections, especially near the edge of the chip where it mates with the substrate. Much of the stress can be relieved by first printing an elastic fillet at the base of the chip to form a flexible ramp leading to the surface. Metal ink traces can then be printed along the ramp to connect between the board and chip I/O.
Dr. Renn will explain how Aerosol Jet is an ideal printing tool for precision deposition of polymeric and metal inks in this 3D application. Aerosol Jet is a non-contact, high resolution printing technology that is compatible with a wide range of conductive, insulating, and resistive materials. He will discuss the printing of robust, flexible and stretchable 3D interconnects with line and space below 50 micrometers and good stability under thermal cycling. Dr. Renn will also provide details on the printing of passive electronic components and sensors.
The InnoLAE conference program will highlight the most innovative and exciting aspects of large-area electronics, (LAE) emerging technologies, and the manufacturing and the development of products incorporating LAE. More than 200 delegates from industry and academia representing 88 different organizations attended innoLAE 2016, making innoLAE a premier large-area electronics conference in the UK. Semitronics, Optomec’s authorized reseller in the UK, will display flexible electronics devices printed with Aerosol Jet in booth 12 at InnoLAE.
In addition to the exhibition, Dr. Mike Renn, CTO for Optomec, will give a presentation in the Flexible Hybrid Systems track, titled “Aerosol Jet Printing of Flexible and Stretchable Interconnects” at 13:45 on Feb. 1.
Dr. Renn’s presentation will discuss how flexible hybrid circuits typically require interconnecting rigid bare silicon or packaged die to a flexible circuit board. Flexing these assemblies can cause extreme stress on the electrical connections, especially near the edge of the chip where it mates with the substrate. Much of the stress can be relieved by first printing an elastic fillet at the base of the chip to form a flexible ramp leading to the surface. Metal ink traces can then be printed along the ramp to connect between the board and chip I/O.
Dr. Renn will explain how Aerosol Jet is an ideal printing tool for precision deposition of polymeric and metal inks in this 3D application. Aerosol Jet is a non-contact, high resolution printing technology that is compatible with a wide range of conductive, insulating, and resistive materials. He will discuss the printing of robust, flexible and stretchable 3D interconnects with line and space below 50 micrometers and good stability under thermal cycling. Dr. Renn will also provide details on the printing of passive electronic components and sensors.
The InnoLAE conference program will highlight the most innovative and exciting aspects of large-area electronics, (LAE) emerging technologies, and the manufacturing and the development of products incorporating LAE. More than 200 delegates from industry and academia representing 88 different organizations attended innoLAE 2016, making innoLAE a premier large-area electronics conference in the UK. Semitronics, Optomec’s authorized reseller in the UK, will display flexible electronics devices printed with Aerosol Jet in booth 12 at InnoLAE.