01.15.16
STMicroelectronics exhibited its latest Smart-Driving solutions at the 8th International Automotive Electronics Technology Expo (CAR-ELE JAPAN) in Tokyo, Japan. ST contributes to the development of cutting-edge Smart-Driving technologies including Advanced Driver-Assistance Systems (ADAS), connectivity, and advanced safety/environmental performance, with semiconductors playing a key role in the creation of these technologies.
In ADAS, ST will demonstrate a vehicle-to-vehicle and vehicle-to-infrastructure (V2X) communication chipset co-developed with the Israeli company Autotalks. Integrating a baseband, a host microcontroller unit (MCU), and a secure MCU, the chipset employs V2X communication technologies that leverage GPS data and Wi-Fi (801.11p), contributing to the creation of automated-driving solutions for analyzing nearby vehicles and road conditions.
The V2X chipset complements ST’s positioning IC, which supports all major Global Navigation Satellite Systems (GNSS). ST will also introduce an in-car CMOS camera module with a high dynamic range and best-in-class signal-to-noise ratio in low-light conditions, targeting vision-based systems that detect pedestrians, obstacles, road signs, and traffic lanes.
In anticipation of a future where vehicles become connected to the Internet and mobile devices, ST offers secure MCUs for Automotive that comply with the Trusted Platform Module (TPM) 2.0 security specification, achieving the maximum level of security in the physical layer. At CAR-ELE 2016, ST will also show how in-car devices connect to a smartphone using an NFC device, and a network processor that complies with the automotive-grade Bluetooth Low Energy specification.
Today, automobiles contain a multitude of sensors that collect information about the vehicle enabling advanced safety features. A major supplier of in-car MEMS (micro-electro-mechanical system) technologies, ST will demonstrate various in-car MEMS sensors at the show, including a three-axis acceleration sensor for a car emergency notification system and one/two-axis acceleration sensors for airbags.
In ADAS, ST will demonstrate a vehicle-to-vehicle and vehicle-to-infrastructure (V2X) communication chipset co-developed with the Israeli company Autotalks. Integrating a baseband, a host microcontroller unit (MCU), and a secure MCU, the chipset employs V2X communication technologies that leverage GPS data and Wi-Fi (801.11p), contributing to the creation of automated-driving solutions for analyzing nearby vehicles and road conditions.
The V2X chipset complements ST’s positioning IC, which supports all major Global Navigation Satellite Systems (GNSS). ST will also introduce an in-car CMOS camera module with a high dynamic range and best-in-class signal-to-noise ratio in low-light conditions, targeting vision-based systems that detect pedestrians, obstacles, road signs, and traffic lanes.
In anticipation of a future where vehicles become connected to the Internet and mobile devices, ST offers secure MCUs for Automotive that comply with the Trusted Platform Module (TPM) 2.0 security specification, achieving the maximum level of security in the physical layer. At CAR-ELE 2016, ST will also show how in-car devices connect to a smartphone using an NFC device, and a network processor that complies with the automotive-grade Bluetooth Low Energy specification.
Today, automobiles contain a multitude of sensors that collect information about the vehicle enabling advanced safety features. A major supplier of in-car MEMS (micro-electro-mechanical system) technologies, ST will demonstrate various in-car MEMS sensors at the show, including a three-axis acceleration sensor for a car emergency notification system and one/two-axis acceleration sensors for airbags.