07.16.15
Applied Materials, Inc. announced a next-generation etch tool, the Applied Centris Sym3 Etch system, featuring an entirely new chamber for atomic-level precision manufacturing. To overcome within-chip feature variations, the Centris Sym3 system provides chipmakers with the control and precision needed to pattern and create densely packed 3D structures in advanced memory and logic chips.
“The Sym3 system represents a brand new design, built from the ground up, that solves persistent and impending industry challenges,” said Dr. Raman Achutharaman, VP and GM of Applied’s Etch business unit. “Customer traction has been remarkable, resulting in the fastest adoption rate we’ve seen for an etch tool in the company’s history, with record ramp to production at leading-edge fabs.”
Key to the design is a focus on controlling and removing etch byproducts, which are increasingly hampering within-chip patterning uniformity. The system mitigates byproduct re-deposition to overcome the challenges of line edge roughness, pattern loading and defects - issues that are becoming more limiting for each successive technology node.
“The Sym3 system represents a brand new design, built from the ground up, that solves persistent and impending industry challenges,” said Dr. Raman Achutharaman, VP and GM of Applied’s Etch business unit. “Customer traction has been remarkable, resulting in the fastest adoption rate we’ve seen for an etch tool in the company’s history, with record ramp to production at leading-edge fabs.”
Key to the design is a focus on controlling and removing etch byproducts, which are increasingly hampering within-chip patterning uniformity. The system mitigates byproduct re-deposition to overcome the challenges of line edge roughness, pattern loading and defects - issues that are becoming more limiting for each successive technology node.